“Secondary electron hyperspectral imaging (SEHI) is an innovative SEM-based analysis tool allowing spatially-resolved chemical analysis beyond elemental composition”.

No abstract

Phenolics are widely used for over a century in different industries due to their chemical resistance and thermomechanical properties. However, the presence of voids in phenolic resins has negative effects on the mechanical properties and a conventional approach is to avoid these by utilizing very long cure cycles. Our alternative approach investigates the tailoring of void size and distribution to achieve a better balance between processing time and mechanical properties. Therefore, we produced phenolic resin with a void-free microstructure by a long cure cycle as a reference. To alter the void size and distributions, we utilized different catalysts and a short cure cycle to obtain phenolic resins and test their flexural properties with respect to the reference. We investigated the fracture surfaces of all materials by SEM, FTIR and compared results to finite element modeling that confirmed the effects of different void size and distributions on the mechanical properties.