In this paper, we investigated the simulation and fabrication of an E-shaped microstrip patch antenna realized on multilayered polyester fabric suitable for WiMAX (Worldwide Interoperability for Microwave Access) applications. The main challenges while designing a textile antenna were to provide adequate thickness, surface uniformity and water wettability to the textile substrate. Here, three layers of polyester fabric were stacked together in order to obtain sufficient thickness, and were subsequently dip coated with polyvinyl butyral (PVB) solution. The PVB-coated polyester fabric showed a hydrophobic nature with a contact angle of 91°. The RMS roughness of the uncoated and PVB-coated polyester fabric was about 341 nm and 15 nm respectively. The promising properties, such as their flexibility, light weight and cost effectiveness, enable effortless integration of the proposed antenna into clothes like polyester jackets. Simulated and measured results in terms of return loss as well as gain were showcased to confirm the usefulness of the fabricated prototype. The fabricated antenna successfully operates at 3.37 GHz with a return loss of 21 dB and a maximum measured gain of 3.6 dB.

Alumina, thanks to its superior thermal and dielectric properties, has been the leading substrate over several decades, for power and microelectronics circuits. However, alumina lacks thermal stability since its temperature coefficient of resonant frequency (τf) is far from zero (−60 ppmK−1). The present paper explores the potentiality of a ceramic composite 0.83ZnAl2O4-0.17TiO2 (in moles, abbreviated as ZAT) substrates for electronic applications over other commercially-used alumina-based substrates and synthesized using a non-aqueous tape casting method. The present substrate has τf of + 3.9 ppmK−1 and is a valuable addition to the group of thermo-stable substrates. The ZAT substrate shows a high thermal conductivity of 31.3 Wm−1K−1 (thermal conductivity of alumina is about 24.5 Wm−1K−1), along with promising mechanical, electrical and microwave dielectric properties comparable to that of alumina-based commercial substrates. Furthermore, the newly-developed substrate material shows exceptionally good thermal stability of dielectric constant, which cannot be met with any of the alumina-based HTCC substrates.

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