Microscopic lipid tubules with an average aspect ratio (length/diameter) of approximately 12 were metallized electrolessly with copper or nickel-over-copper, and mixed with vinyl to make foot-square composite dielectric panels. As loadings increased the metal tubule composites displayed an onset of electrical percolation with accompanying sharp increases in real and imaginary permittivities. Gravity-induced settling of the tubules while the vinyl was drying increased true loading density at percolation threshold for nickel/copper tubules to ∼12 vol %. This threshold was at a significantly lower loading density than that previously measured for percolation by composites containing spherical conducting particles. Qualitatively, the shape of the composite permittivity versus loading density curves followed predictions by the effective-mean field theory for conducting stick composites. Changes in permittivity of the vinyl panels were observed for several days after fabrication, and were apparently associated with solvent evaporation from the matrix.

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