Waterproof and self-cleaning surfaces continue to attract much attention as they can be instrumental in various different technologies. Such surfaces are typically rough, allowing liquids to contact only the outermost tops of their asperities, with air being entrapped underneath. The formed solid–liquid–air interface is metastable and, hence, can be forced into a completely wetted solid surface. A detailed understanding of the wetting barrier and the dynamics of this transition is critically important for the practical use of the related surfaces. Toward this aim, wetting transitions were studied in situ at a set of patterned perfluoropolyether dimethacrylate (PFPEdma) polymer surfaces exhibiting surface features with different types of sidewall profiles. PFPEdma is intrinsically hydrophobic and exhibits a refractive index very similar to water. Upon immersion of the patterned surfaces into water, incident light was differently scattered at the solid–liquid–air and solid–liquid interface, which allows for distinguishing between both wetting states by dark-field microscopy. The wetting transition observed with this methodology was found to be determined by the sidewall profiles of the patterned structures. Partial recovery of the wetting was demonstrated to be induced by abrupt and continuous pressure reductions. A theoretical model based on Laplace’s law was developed and applied, allowing for the analytical calculation of the transition barrier and the potential to revert the wetting upon pressure reduction.
Plasma-enhanced atomic layer deposition (PE-ALD) of cobalt (Co) using cyclopentadienylcobalt dicarbonyl [CpCo(CO)2] combined with hydrogen, nitrogen, ammonia, and argon based plasma gases was investigated. The utilized ALD tool was clustered to an ultrahigh vacuum analytic system for direct surface analyses including X-ray photoelectron spectroscopy (XPS). The combination with a nondestructive surface analysis system enabled a sample transfer without vacuum break and thereby a direct qualification and quantification of the chemical surface composition under quasi in situ conditions. The authors studied the influence of process parameters (e.g., pulse times, plasma power, and substrate temperature) on film compositions and film properties. The occurrence and prevention of sputtering effects due to ion bombardment at high plasma powers were discussed. Beyond those results, precise information about the impact of different plasma gas compositions on the resulting film properties was obtained. Cobalt films grown using a hydrogen/nitrogen (H2/N2) plasma as a coreactant showed a stable film composition (CoNx) with a high Co content of 75 at. %. Using scanning electron microscopy and four point probe measurements, a moderate electrical resistivity of about 56 μΩ cm was calculated for a 20 nm film. The high sensitivity of in vacuo XPS measurements allowed investigations of interface reactions for a single PE-ALD pulse as well as investigations of the initial film growth mechanisms. The nucleation of CoNx films during PE-ALD using H2/N2 plasma as a coreactant was investigated on several substrate materials by XPS. After the very first cycle of the PE-ALD process, no Co could be detected on all the investigated substrates. XPS revealed that the plasma pulse was needed to provide active binding sites for the adsorption reaction of precursor molecules due to the formation of Si-Nx or Si-NxOy surfaces. Therefore, the plasma pulse plays an important role in the PE-ALD process of Co on silicon surfaces. The early cycles were characterized by the onset of Co—O bonds. The homogeneous film body on all substrates consisted of Co-nitride compounds.
A novel transistor with a graphene base embedded between two n-type silicon emitter and collector layers (graphene-base heterojunction transistor) is fabricated and characterized electrically. The base voltage controlled current of the device flows vertically from the emitter via graphene to the collector. Due to the extremely short transit time for electrons passing the ultimately thin graphene base, the device has a large potential for high-frequency RF applications. The transistor exhibits saturated output currents and a clear modulation of the collector current by means of the graphene base voltage. The vertical transfer current from the emitter via the graphene base to the collector is much lower than expected from device simulations. A comparison of the graphene-base transistor and a reference silicon n-p-n bipolar transistor is performed with respect to the main DC transistor characteristics. A common-emitter gain of larger than one has been achieved for the reference device while the graphene-base transistor so far exhibits a much lower gain.
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