Articles you may be interested inKinetic model for dependence of thin film stress on growth rate, temperature, and microstructure J. Appl. Phys. 111, 083520 (2012); 10.1063/1.4704683Temperature-driven microstructural, compositional, and magnetic changes in electrodeposited Fe-Pd thin films J. Appl. Phys. 107, 09A712 (2010); 10.1063/1.3337639Structure and magnetic properties of electrodeposited, ferromagnetic, group 3-d element films grown onto GaAs (011) substrateWe have investigated the effects of the current density, film thickness, temperature, and additive agent on the internal stress in electrodeposited nickel thin films using a bent strip measurement. The internal stress is found to obey a scaling law expressed in terms of the current density and film thickness. The additive agent is shown to behave as a noise leading to different exponents in the dynamic scaling theory. In addition, the Arrhenius temperature dependence of the internal stress indicates the presence of thermal activation related to grain growth.

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The effect of temperature on nickel electrodeposition from a nickel sulfamate electrolyte has been investigated. All the experimental points in a plot of nickel film thickness vs. current density collapse onto a single straight line irrespective of deposition temperature. A relation derived from the Butler-Volmer equation is successful in predicting cathode potential shifts caused by change of deposition temperature. Moreover, an interface width, which characterizes the roughness of the surface and is defined by the root mean square of fluctuation in the height, is shown to have a saturated value that is related to the deposition temperature. Thus, two kinds of activation energies for the charge transfer reaction and for grain growth are estimated from the temperature dependence of the cathode potential shift and the grain size.

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