According to the recent growth in interest of human-friendly devices, soft conductors, which are conductive materials with an inherent compliance, must have a low electrical strain sensitivity under large deformation conditions, environmental stability in water, and reliability even for complex and repeated deformation, as well as nontoxic characteristics. In this study, we fabricated a poly­(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS)/polyacrylamide nanoweb that satisfies all of the above requirements through a web microstructure with entangled conductive nanofibers. Since the web structure can be deformed through structural alignment, the conductive path is stably maintained during deformation, which makes it highly conductive, electrically stable, and electrically strain insensitive. The tangled nanofibers are composed of PEDOT:PSS as a conductive component and polyacrylamide as a binding material, so it is nontoxic and has the soft properties of the material itself, which can withstand large deformations. Additionally, the material has a good electrical stability against repeated deformation so that the resistance increased by only 13% after a 50% strain was repeated 1000 times. Notably, electrical instabilities such as noise and hysteresis were not evident during the repeated deformations. Finally, the nanoweb has excellent swelling resistance and maintains its mechanical and electrical characteristics in water.

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A new method to improve the electrical conductivity and elastic modulus of inkjet-printed Ag films by controlling the oxygen pressure during the annealing process (annealing under air after ramping under vacuum) is presented. Compared to the porous layer under the dense surface layer in conventional annealing, densification throughout the entire film was observed in the microstructure treated by oxygen pressure controlled annealing. The electrical resistivity and elastic modulus of Ag films annealed by this new process were 1.95μΩ⋅cm and 47GPa , which are better than those by the conventional process ( 2.48μΩ⋅cm and 40GPa ). It was found that the remaining of capping molecules during the ramping in vacuum act as the inhibitor of grain evolution and retard the onset of grain growth at higher temperature, which begins by blowing air into the annealing atmosphere.

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The increase of electrical resistance during the strain-controlled bending fatigue of 2 µm-thick inkjet-printed or vacuum deposited metallic films (Cu, Ag) on flexible substrates (BT: Bismaleimide Triazine, PI: Polyimide) was investigated. Electrical resistance increased with an increase in the number of fatigue cycles. The rate of increase in the electrical resistance of inkjet-printed Cu films was lower than that of thermally evaporated films. This phenomenon is attributable to the porous microstructure of inkjet-printed Cu films. The porous structure contains a lot of free volume and a large area of free surface, which can be a sinking site for vacancies formed during the cyclic deformation. It was confirmed that a smaller grain size leads to a lower rate of increase in the electrical resistance, which was ascribed to the easy vacancy annihilation due to a short diffusion length of the vacancy to the grain boundary which is a vacancy sinking site. The rate of increase in the electrical resistance was also influenced by the grain boundary geometry. The lower rate of the evaporated Ag film on a BT substrate was attributed to the crack-like grain boundaries, which were expected to behave like pores.