This paper presents a newly proposed T model of spiral inductors in 90nm radio frequency (RF) CMOS technology. Inductor modeling is one of the most difficult problems facing silicon-based RF integrated circuit designers, and the inclusion of many parameters of the inductor equivalent circuit consumes a lot of time during circuit simulation. In this paper, two models of spiral inductors were simulated to compare their agreement with the measured data from IOOMHz to IOGHz. The proposed T-model had less parameters than the conventional double-n model, and also showed good agreement in the RF performance of the spiral inductors, such as quality factor (Q-factor) and inductance (L). In addition, the proposed T-model had an error rate of less than 5% with the S parameter of measured data, similar to the double-n model.

In this paper, octagonal inductors for RFIC designs was fabricated with 90nm CMOS Technology to compare its quality factor and the effective inductance as functions of radius and number of turn. The quality factor decreases as the inner radius and the number of metal turned increase. However, the effective inductance increases with the increasing the inner radius and the number of metal turned. Therefore, the inductor structure should be decided according to the relative importance of Q-factor and inductance.

Abstract-In this paper, the RF characteristics of multi-finger MOSFETs were improved by decreasing the parasitic capacitance in spite of increased gate resistance in a 90-nm CMOS technology. Two types of device structures were designed to compare the parasitic capacitance in the gate-to-source (C gs ) and gate-to-drain (C gd ) configurations. The radio frequency (RF) performance of multi-finger MOSFETs, such as cut-off frequency (f T ) and maximum-oscillation frequency (f max ) improved by approximately 10% by reducing the parasitic capacitance about 8.2% while maintaining the DC performance.

In this paper, we investigated the hot carrier reliability of two kinds of device with low threshold voltage (LVT) and regular threshold voltage (RVT) in 65 nm CMOS technology. Contrary to the previous report that devices beyond 0.18 μm CMOS technology is dominated by channel hot carrier(CHC) stress rather than drain avalanche hot carrier(DAHC) stress, both of LVT and RVT devices showed that their degradation is dominated by DAHC stress. It is also shown that in case of LVT devices, contribution of interface trap generation to the device degradation is greater under DAHC stress than CHC stress, while there is little difference for RVT devices.