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Purpose This paper aims to invastigate of the wetting and interfacial properties of Sn-(3-x)Ag-0.5Cu-(x)Bi (x = 0.5, 1 and 2 in Wt.%) Pb-free solder alloys at various temperatures ( 250, 280 and 310°C) on Cu substrate in Ar atmosphere. Design/methodology/approach In this study, new Sn-(3-x)Ag-0.5Cu-xBi systems, low Ag content quaternary lead-free solder alloys, were produced by adding 0.5, 1 and 2% Bi to the near-eutectic SAC305 alloy. The wetting angles of three new alloys, Sn-2.5Ag-0.5Cu-0.5 Bi(SAC-0.5 Bi), Sn-2Ag-0.5Cu-1Bi(SAC-1Bi) and Sn-1Ag-0.5Cu-2Bi(SAC-2Bi) were measured by sessile drop technique on the Cu substrate in argon atmosphere. Findings In accordance with the interfacial analyses, intermetallic compounds of Cu3Sn, Cu6Sn5, and Ag3Sn were detected at the SAC-Bi/Cu interface. The results of wetting tests show that the addition of 1 Wt.% Bi improves the wetting properties of the Sn-3Ag-0.5Cu solder. The lowest wetting angle (θ) was obtained as 35,34° for Sn-2Ag-0.5Cu-1Bi alloy at a temperature of 310 °C. Originality/value This work was carried out with our handmade experiment set and the production of the quaternary lead-free solder alloy used in wetting tests belongs to us. Experiments were conducted using the sessile drop method in accordance with wetting tests.

The aim of this study is to investigate the corrosion behavior of potentiodynamic polarization indium added Sn-3Ag-0.5Cu alloy in 1M HCl solution. SEM and EDX analyses were examined the properties of the alloy samples. Polarization analyses showed by the addition of 0.5, 1, and 2 wt.% indium to the SAC305 solder alloy does not lead to notably different corrosion potentials. The pseudo-passivation region is observed instead of a true passivation region that currents are nearly constant. By the scanning interval, this pseudo-passive region does not have a reactivation point. On the other hand, corrosion rates follow a pattern in which 0.5% wt of indium substitution of silver causes the corrosion rate to decrease. However, with further silver replacement by indium, the rate of corrosion increases. According to the results of microstructure analysis, the formation of corrosion products and the existence of voids and porous structures limit their stability.

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