In this work, bulk-micromachined -oriented silicon mirrors at have been fabricated in 20 wt% KOH solution at various temperatures and characterized with single-mode fibers (10/125 and 5/125). In fabricating the mirrors, the etch rate of the (100) silicon surface was widely varied from 5.3 to as the processing temperatures were varied from 40 to C. In spite of the tremendous variation of etch rate, the measured reflectivities of the mirrors showed fairly stable values of 63.7 - 58% at 1330 nm and 55.4 - 57.7% at 1550 nm. This paper describes the silicon mirror processing conditions, measured reflectivities, reflected beam profiles, and a prototype integrated optical I - O coupler with the realized mirrors. The results obtained from this work show that optical I - O couplers with mirrors on conventional (100)-oriented silicon wafers are feasible, enabling us to envisage a synchronized optical clock distribution system as well as a distributed remote optical sensing system with low manufacturing cost.

No abstract

No abstract

In this work, bulk-micromachined { 1 1 1}-oriented silicon mirrors at 54.7° have been fabricated in 20 wt% KOH solution at various temperatures and characterized with single mode fibers (10/125 and 51125). In fabricating the mirrors, the etch rate of the (100) silicon surface was widely changed from 5.3 tm/hr to 73 jim/hr as the processing temperatures were varied from 40 °C to 80 °C. In spite of the tremendous variation of etch rate, the measured reflectivities of the mirrors showed fairly stable values of 63.7 -58 % at 1330 nm and 55.4 -57.7 % at 1550 nm respectively. This paper describes the silicon mirror processing conditions, measured reflectivities, reflected beam profiles, and a prototype integrated optical I/O coupler with the realized mirrors. The results obtained from this work show that optical I/O couplers with 54.7° mirrors on conventional (100)-oriented silicon wafers are feasible, envisaging a synchronized optical clock distribution system as well as a distributed remote optical sensing system with low manufacturing cost.

No abstract