3D logic-on-logic technology is a promising approach for extending the validity of Moore's law when technology scaling stops. 3D technology can also lead to a paradigm shift in on-chip communication design by providing orders of magnitude higher bandwidth and lower latency for inter-layer communication. To turn the 3D technology bandwidth and latency benefits into network latency reductions and performance improvement, we need networks-on-chip (NoCs) that are specially designed to take advantage of what 3D technology has to offer. While in parallel workloads many packets experience blocking in the network due to losing arbitration for crossbars' input/output ports, we observe that in a considerable fraction of these cases in a 3D NoC, the corresponding input and output ports of the crossbar in the above or below router are idle. Given this observation, we propose FRESH, a router microarchitecture with Fine-grained 3D REsource SHaring capability that leverages the ultra-low latency vertical links of a 3D chip to share crossbars and links at a fine granularity between vertically stacked routers. It enables packets that lose arbitration for crossbars' input/output ports to use idle resources of the above or below routers, and effectively eliminates the unnecessary packet blocking time. We will show that our proposal lowers network latency by up to 21% over the state-of-the-art 3D NoC.
3D integration is a practical solution for overcoming the failure of Dennard scaling in future technology generations. This emerging technology stacks several die slices on top of each other on a single chip in order to provide higher-bandwidth and lower-latency than a 2D design due to extremely shorter inter-layer distances in the third dimension and. In this paper, we leverage the lowlatency vertical links to address buffer management, one of the most important design and management issues in Network-on-Chip (NoC). To this end, we present VerBuS, an architecture for 3D routers with Vertical BUffer Sharing capability enabled by ultra-low latency vertical links of a 3D chip. VerBuS can share virtual channels (VC) between vertically stacked routers. This way, the buffering capacity of a highly loaded router is increased by using idle VCs of vertically adjacent routers. Experimental results show up to 20% improvement in NoC performance metrics over state-ofthe-art 3D router designs.
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