This study, for the first time, focused on the fabrication of nonporous polyurea thin films (~200 microns) using the electrospinning method as a novel approach for coating applications. Multi-walled carbon nanotubes (MWCNTs) and hydrophilic-fumed nanosilica (HFNS) were added separately into electrospun polyurea films as nano-reinforcing fillers for the enhancement of properties. Neat polyurea films demonstrated a tensile strength of 14 MPa with an elongation of 360%. At a loading of 0.2% of MWCNTs, the highest tensile strength of 21 MPa and elongation of 402% were obtained, while the water contact angle remained almost unchanged (89°). Surface morphology analysis indicated that the production of polyurea fibers during electrospinning bonded together upon curing, leading to a nonporous film. Neat polyurea exhibited high thermal resistance with a degradation temperature of 380 °C. Upon reinforcement with 0.2% of MWCNTs and 0.4% of HFNS, it increased by ~7 °C. The storage modulus increased by 42 MPa with the addition of 0.2% of MWCNTs, implying a superior viscoelasticity of polyurea nanocomposite films. The results were benchmarked with anti-corrosive polymer coatings from the literature, revealing that the production of nonporous polyurea coatings with robust strength, elasticity, and thermal properties was achieved. Electrospun polyurea coatings are promising candidates as flexible anti-corrosive coatings for heat exchanges and electrical wires.

No abstract

Polyurea (PU) is intrinsically reinforced by its microphase-separated morphology, giving its excellent mechanical properties. In this study, it is shown how a high-index PU formulation applies easy diffusion of hard segments into the soft phase of the PU matrix and tune its chain mobility. Moreover, the interaction of micro (>100 nm), nano (<100 nm) fillers with the microdomains and their thermomechanical properties are unraveled. Herein, nanosilica oxide (NS) and micro titanium (III) oxide (Ti 2 O 3 ) are incorporated at low loadings into a solvent-free two-component aliphatic PU via insitu polymerization. While NS achieves an interfacial interaction with urea groups and forms a tight hard segmental packing, the large-sized Ti 2 O 3 assembles the interconnected PU chain network, improving its crystallinity. Strong reinforcement by NS is noticed when tensile strength increased from 26 to 31 MPa and on the maximum thermal degradation temperature by 21 °C increment from the neat PU. In contrast, the soft segmental dynamics are triggered with the presence of Ti 2 O 3 as indicated in the reduction in glass transition temperature and the 288% improvement in the storage modulus. This study provides an insightful perspective in designing robust PU composites, effective for myriad applications including strong and flexible films in circuit boards and photovoltaic (PV) cells.

No abstract

No abstract