The purpose and method of this paper is to comparatively analyze several commonly-used cushion packaging materials, obtain their shock absorption characteristic curves, and by doing such, provide reference information for cushion packaging design and research. With the static test, dynamic compression test and vibration transfer test carried out, the cushion coefficient ~ static stress curve, maximal acceleration ~ static stress curve and vibration transfer rate ~ frequency curve are gained. A final conclusion is educed that in practical design routine, rational choice of cushion packaging materials, scientific design of packaging structure and validation of anti-vibration capability are relative to those three curves.

Plasmonic, including of located surface Plasmon resonance (LSPR) and surface plasmon polariton (SPP), is a special kind of electromagnetic mode in nanometer scale. Plasmonic nanostructures can be generated to improving the conversion efficiency of photovoltaic devices. In the paper, the concepts of plasmonic and their influences by different metal nanostructure were introduced. Then the different principles of light utilization of plasmonic nanostructure in thin film photovoltaic cell was analyzed.

A new green packaging material—honeycomb board was studied. Several main technical parameters were tested and some advice was put forward on development of honeycomb board.

Anaerobic multilevel anoxic/oxic (AMAO) process is a new phosphorus and nitrogen removal process, has the advantages of high treatment efficiency and low operation energy consumption and has extensive application in China. In order to further optimize the process, AMAO process should be combined organically with low DO aeration technology, the technical features, the necessity of technical combination, engineering example and application effect are elaborated in this paper.

Corrugated board is a packaging material with many advantages and widely used. Based on the performance of corrugated board, its cushioning package application was studied, the CAD system of transport package was designed, which changes the process of traditional packaging design, cuts the cost, improves the efficiency and shows a broad application prospect.