A new fluoroepoxy resin has been developed that can be processed as a conventional thermoset resin yet possesses some of the unique properties of the well-known thermoplastic fluoropolymers. Its moisture vapor transmission rate and moisture absorption were found to be unusually low. In general, the transmission rates were Inversely proportional to the fluorine content of the materials tested. The fluoroepoxy was shown to be an excellent moisture vapor barrier coating or sealant and an effective adhesive to bond Teflon without etching. It could be foamed by a new and simple foaming process. Other potential applications suggested are conformal coating, encapsulation, and potting for electronics.

No abstract

Polyphenylene oxide was surface‐sulfonated with chlorosulfonic acid to provide antistatic properties. Optimal treatment time was shown to be 2–3 mins with a saturated solution of the acid in hexane or 25–30 mins using acid vapor‐saturated air under the given experimental conditions at room temperature. Being sensitive to humidity, the resistivity of the treated surface was lowered to the magnitude of 107 to 108 ohm/square at 43 percent relative humidity and to 1011 at 10 percent relative humidity. The vapor phase method was found to be superior to the solution method with respect to the durability of the treated surface against water washing. Microscopic examination revealed extensive surface erosion by the solution treatment.