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Effects of low Cu additions (≤0.10 wt%) and 10% pre-deformation before aging on precipitate microstructures and types in a 6060 Al-Mg-Si alloy have been investigated using transmission electron microscopy (TEM). It was found that pre-deformation enhances precipitation kinetics and leads to formation of heterogeneous precipitate distributions along dislocation lines. These precipitates were often disordered. Cu additions caused finer microstructures, which resulted in highest materials hardness, in both the un-deformed and the pre-deformed conditions. The introduced pre-deformation led to microstructure coarsening. This effect was less pronounced in the presence of Cu. The precipitate structure was studied in detail by high resolution TEM (HRTEM) and high angle annular dark field scanning TEM (HAADF-STEM). The Cu additions did not alter the respective precipitation sequence in either the un-deformed or the pre-deformed conditions, but caused a large fraction of β'' precipitates to be partially disordered in the undeformed conditions. Cu atomic columns were found in all the investigated precipitates, except for perfect β''. Although no unit cell was observed in the disordered precipitates, the presence of a periodicity having hexagonal symmetry along the precipitate length was inferred from the fast Fourier transforms (FFT) of HRTEM images, and sometimes directly observed in filtered HAADF-STEM images.

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The polarity determination process of sputter-deposited aluminum nitride (AlN) on metals has been analyzed using aberration corrected atomic resolution scanning transmission electron microscope. Direct growth of c-axis orientated AlN on face centered cubic metals (fcc) (111) with the local epitaxy has been observed, and the polarity was determined at the AlN/metal interface. We found that the AlN polarity can be controlled by the base metal layer: N-polarity AlN grows on Pt(111) while Al-polarity AlN forms on Al(111). Based on these results, the growth mechanism of AlN on metals is discussed.

Strong perpendicular exchange bias was realized in sputter-deposited CoPt/CoO multilayers. The as-deposited multilayer shows strong perpendicular magnetic anisotropy (PMA) which remains up to a critical CoPt layer thickness as thick as 4 nm. After perpendicular field cooling, the multilayer with antiferromagnetic CoO and ferromagnetic CoPt interfaces exhibits large perpendicular exchange bias of 1730 Oe. Strong PMA in the CoPt/CoO multilayer is mainly attributed to the positive magnetoelastic energy due to the remarkable in-plane tensile stress originating from the local epitaxial growth. The mechanism for the exchange bias was explained in terms of the interfacial spin structure.