Gallium (Ga) and some of its alloys have a range of properties that make them an attractive option for microelectronic interconnects, including low melting point, non-toxicity, and the ability to wet without fluxing most materials—including oxides—found in microelectronics. Some of these properties result from their ability to form stable high melting temperature solid solutions and intermetallic compounds with other metals, such as copper, nickel, and aluminium. Ga and Ga-based alloys have already received significant attention in the scientific literature given their potential for use in the liquid state. Their potential for enabling the miniaturisation and deformability of microelectronic devices has also been demonstrated. The low process temperatures, made possible by their low melting points, produce significant energy savings. However, there are still some issues that need to be addressed before their potential can be fully realised. Characterising Ga and Ga-based alloys, and their reactions with materials commonly used in the microelectronic industry, are thus a priority for the electronics industry. This review provides a summary of research related to the applications and characterisation of Ga-based alloys. If the potential of Ga-based alloys for low temperature bonding in microelectronics manufacturing is to be realised, more work needs to be done on their interactions with the wide range of substrate materials now being used in electronic circuitry.

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Abstract. The aim of the present study was to elucidate the effect of transmembrane protein 16A (TMEM16A) on portal vein smooth muscle cell (PVSMC) proliferation associated with portal vein remodeling in portal hypertension (PHT). Sprague-Dawley rats were subjected to bile duct ligation to establish a rat model of liver cirrhosis and PHT. Sham-operated animals served as controls. At 8 weeks after bile duct ligation, the extent of liver fibrosis and the portal vein wall thickness were assessed using hematoxylin-eosin staining. The protein expression levels of TMEM16A, extracellular signal-regulated kinase 1 and 2 (ERK1/2) and phosphorylated ERK1/2 (p-ERK1/2) in the portal vein were detected by immunohistochemistry and western blotting. In vitro, the lentivirus vectors were constructed and transfected into PVSMCs to upregulate the expression of TMEM16A. Isolated rat primary PVSMCs were treated with a small molecule inhibitor of TMEM16A, T16A-inhA01. Cell cycle was detected by flow cytometry. The activity of TMEM16A in the portal vein isolated from bile duct ligated rats was decreased, while the expression level of p-ERK1/2 was increased. However, in vitro, upregulation of TMEM16A promoted the proliferation PVSMCs, while inhibition of TMEM16A channels inhibited the proliferation of PVSMCs. The results indicated that TMEM16A contributes to PVSMCs proliferation in vitro, but in vivo, it may be a negative regulator of cell proliferation influenced by numerous factors.

Ga alloys have been attracting significant renewed attention for lowtemperature bonding applications in electronic packaging. This study systematically investigates the interfacial reaction between liquid Ga and Cu-10Ni substrates at 30 °C. In addition to CuGa 2 formed from binary Ga/Cu couples, a layer of nanocrystalline Ga 5 Ni and CuGa 2 formed between the Cu-10Ni substrate and the blocklike micrometer scale CuGa 2 layer. The growth of interfacial intermetallics (IMCs) on the Cu-10Ni substrate was substantially accelerated compared to the IMC growth in binary Ga/Cu couples. Reaction kinetics study shows the IMC growth from the Cu-10Ni substrate was controlled by reaction and volume diffusion, while the IMC growth from the Cu substrate was controlled by volume diffusion. It is also found that the presence of Ni within the CuGa 2 phase resulted in improved thermal stability and a smaller coefficient of thermal expansion during heating from 25 to 300 °C, using synchrotron XRD analysis. There was least thermal expansion anisotropy among most of the IMCs that form in conventional Sn-based solder alloys, including Cu 6 Sn 5 and so forth. It is concluded that using a Cu-10Ni substrate as opposed to a Cu substrate could achieve sufficient metallurgical bonding within shorter processing time. The results have implications for broadening the application temperatures when using Ga as a low-temperature joining material.

The problem of trajectory tracking control for an underactuated stratospheric airship with model parameter uncertainties and wind disturbances is addressed in the paper. An adaptive backstepping sliding-mode controller is designed from the airship nonlinear dynamics model. The proposed controller has a two-level structure for trajectory guidance, tracking and stability, and the developed controller, based on nonlinear adaptive sliding-mode backstepping method, provides airship attitude and velocity control for the entire flight process. Furthermore, an active set based weighted least square algorithm is applied to find the optimal control surface inputs and the thruster commands under constraints of actuator saturation. The closed-loop system of trajectory tracking control plant is proved to be globally asymptotically stable by using Lyapunov theory. By comparing with traditional backstepping control and PID design, the results obtained demonstrate the capacity of the airship to execute a realistic trajectory tracking mission under two cases of lateral-and roll-underactuations, even in the presence of aerodynamic coefficient uncertainties, and wind disturbances.