The thermal and dielectric properties of medium density fiberboard (MDF) with different moisture contents were measured by light flash and the parallel-plane capacitor method, respectively. The results show that increasing moisture content has a positive effect on both thermal properties and dielectric properties. The higher the moisture content, the higher the thermal conductivity and dielectric properties were. The thermal conductivity of MDF with different moisture contents varies in the temperature range of 25 to 150 ºC in a double-hump pattern rather than a proportional pattern. The dielectric constant decreases with increasing frequency up to 1000 MHz. The dielectric loss factor undulates within the frequency range of 1 to 100 MHz, and the peak value occurs at around 10 MHz. The results presented in this study can be used for radio frequency heating, wood building energy, material design, and radio frequency evaluation.

No abstract

The effect of temperature in the range from 25 ºC to 175 ºC on the bending performance of plywood and medium density fiberboard (MDF) has been studied with the ultimate purpose of optimizing the post-processing using radio frequency heating and improving the quality of the final products. Static 3-point bending tests were conducted on a universal testing machine inside a computer-controlled chamber. Results show that the bending strength (MOR) and modulus of elasticity (MOE) of plywood and MDF decrease with the increase of the temperature from 25 ºC to 175 ºC. The bending strength of plywood and MDF decreases with the increase of the exposure time. However, the effects of exposure time on MOE of plywood and MDF are not obvious. Plywood and 2.6 mm thick MDF show a typical elasto-plastic behavior, while 12 mm thick MDF does not exhibit any plastic behavior. It is recommended that the post-processing procedure should be completed within 15 minutes for both MDF and plywood.