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This article reviews the development of uncooled infrared focal plane array (UIFPA) imaging in China in the past decade. Sensors based on optical or electrical read-out mechanism were developed but the latter dominates the market. In resistive bolometers, VOx and amorphous silicon are still the two major thermal-sensing materials. The specifications of the IRFPA made by different manufactures were collected and compared. Currently more than five Chinese companies and institutions design and fabricate uncooled infrared focal plane array. Some devices have sensitivity as high as 30 mK; the largest array for commercial products is 640×512 and the smallest pixel size is 17 µm. Emphasis is given on the pixel MEMS design, ROIC design, fabrication, and packaging of the IRFPA manufactured by GWIC, especially on design for high sensitivities, low noise, better uniformity and linearity, better stabilization for whole working temperature range, full-digital design, etc.

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This paper presents a 320×240 indirect time of flight (I-ToF) image sensor with 5.6μm×5.6μm 2-Tap pixel in 110nm process. The readout channel offset cancellation and nonlinearity suppression techniques are proposed to achieve high-precision detection. The measured relative precision is 1% at a 5m target distance and non-linearity is below 1.02%. The chip also integrates LVDS and I2C interface for data transmission and Laser control. This work effectively improved the ranging accuracy with a simple method.