Pulsed laser welding has proven to be the preferred bonding method that best facilitates the automated fiber alignment and bonding process of optoelectronic devices. However, a combination of considerations regarding (1) the high capital investment for a laser welding workstation (LWWS), (2) acquiring and developing the packaging technology for laser welding, and (3) the undeveloped demand in the market place have caused hesitation by many manufacturers in adopting the process. Typically, the majority of packages manufactured with laser welding have been higher-end priced devices. Further understanding and improvement of technical challenges, such as 'post-weld-shift' control, material selection, and package design, along with development of a cost-effective semi-automated LWWS are presenting a greater opportunity for a broader range of packages to be designed for laser welding, especially for low-cost singlemode datacom packages. The focus of the current work is to design a broad range of OE packages and develop a nanometer precision automation process for laser welding technology. The solution is recognized to be the combination of understanding the laser welding process, designing packages for laser welding, and developing an automation capability for manufacturing.

Fusion zone microstructural evolution of Al-10% Si coated hot stamping steel during laser welding and its mechanical properties were investigated in this study. During laser welding, a liquidized Al-10% Si coating penetrated along the fusion boundary to form δ-ferrite. After hot stamping heat treatment, the final microstructure was composed of a martensite-ferrite dual phase. The dual phase formation causes mixed mode fracture (brittle fracture + ductile fracture) at the fusion zone due to the hardness difference between the martensite and ferrite phases. This issue can be addressed by applying filler wire or by changing the coating system from an Al-based coating to a Zn-based coating.

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