In the production of n‐type Si solar cells, B diffusion is commonly applied to form the p+ emitter. Up to now, Ag screen‐printing pastes, generally used to contact P emitters, had been incapable of reliably contact B emitters. Therefore, a small amount of Al is generally added to Ag pastes to allow for reasonable contact resistances. The addition of Al, however, results in deep metal spikes growing into the Si surface that can penetrate the emitter. Losses in open‐circuit voltage are attributed to these deep metal spikes. In this investigation we demonstrate, that state‐of‐the‐art Al‐free Ag screen‐printing pastes are capable to contact BBr3‐based B emitters covered with different dielectric layers and reach specific contact resistances <1 mΩ cm2. Bifacial n‐type solar cells with Al‐free Ag pastes on both sides show efficiencies of up to 18.3% and series resistances <0.5 Ω cm2. (© 2016 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)

Abstract-In this paper, the influence of Al particle size and the applied firing profile on void formation in local rear contacts of wafer-based silicon solar cells is investigated. Samples with a passivated emitter and rear cell (PERC) rear, but without front metallization, were metalized with six different Al screen-printing pastes, i.e., both commercial and homemade, featuring different particle size distributions and fired in a rapid thermal processing furnace with different firing profiles. Voids were detected with scanning acoustic microscopy measurements, and the fraction of voids in rear local contacts was analyzed. It was shown that the heating phase of the firing process has the strongest influence on void formation. With slower heating, void formation could be reduced to a fraction lower than 5% of the local contact area. Furthermore, it was shown that Al pastes consisting of a mixture of small and large Al particle sizes have a positive effect on the formation of voids.

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The reduction of void formation in local Al contact structures is of high interest in studies dealing with passivated emitter and rear contact (PERC) solar cells. So far, several processing parameters and their impact on local contact formation were investigated in detail. However, up to now density variation of Al in dependence on temperature and Si content in the melt were not taken into account as a principal reason for void formation. In this context the current assumption of a constant volume of the Al paste particles is discussed in more detail. Based on the results of energy dispersive X‐ray spectroscopy, void formation implies either an expansion of paste particles or their burst during contact formation. (© 2016 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)