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In this work we describe a new Poly-Silicon TFT based pixel circuit which provides very good linearity over a large current range (∼ 25 µA) while using only four TFTs and a single control line. We also show that our approach can result in a factor of 3 improvement in current range of amorphous Silicon TFT based pixel circuits.

Conductor moving in magnetic field is quite common in electrical equipment. The numerical simulation of such problem is vital in their design and analysis of electrical equipment. The Galerkin finite element method (GFEM) is a commonly employed simulation tool, nonetheless, due to its inherent numerical instability at higher velocities, the GFEM requires upwinding techniques to handle moving conductor problems. The streamline upwinding/Petrov-Galerkin (SU/PG) scheme is a widely acknowledged upwinding technique, despite its error peaking at the transverse boundary. This error at the transverse boundary is found to be leading to non-physical solutions. Several remedies have been suggested in the allied fluid dynamics literature, which employs non-linear, iterative techniques. The present work attempts to address this issue, by retaining the computational efficiency of the GFEM. By suitable analysis, it is shown that the source of the problem can be attributed to the Coulomb's gauge. Therefore, to solve the problem, the Coulomb's gauge is taken out from the formulation and the associated weak form is derived. The effectiveness of this technique is demonstrated with pertinent numerical results.

Miniaturisation of a bulky system requires effective use and integration of modern packaging technology to achieve smaller size and lighter weight while consuming low power and achieving high speed. Using three-dimensional packaging technology, a system can be miniaturised to a small package popularly known as system-in-a-package (SIP). Various layers of component integration (die or packaged) in the horizontal and vertical directions lead to a compact system in a single package. In this paper, the development of an analog multi-chip module (MCM) is illustrated using 3-D technology. The major goals achieved using this technology are the mixedsignal integration, arealsize reduction, and low power. A comparison is made with the systemon-a-chip (SOC) technology and their merits and demerits are also discussed.