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The use of microchannel has increased in various fields such as microelectronic chips, which are cooled using a heat exchanger and other different purposes. The project is impacting on Nusselt’s estimated value by introducing a new charge through the second charging station and the flow of the main channel to increase the heat transfer rate in the integrated wall by performing mathematical simulations. First, the performance of the recharge concept is assessed by studying the representation of the 2-D model (i.e., the flow between the two plates) and then comparisons are made between the simple and charged case. Numerical analysis was performed for the 3-D case on three different microchannel geometries with two Reynold numbers (Re = 500,1000) and 11 different objects with different thermal conductivity values. In this project laminar flow is considered and the walls are considered adiabatic and continuous heat is supplied to the lower wall. It is noted that the heat transfer rate is increasing as Nusselt’s average value increases due to the introduction of a new charge. Therefore, the efficiency of the microchannel increases with the development of the concept of recharge. In line with this we look at the effects of axial conduction on the local Nusselt number. By varying the ksf (i.e., using different materials) it is found that high value of conductivity results in axial back conduction and which ultimately decrease the Nusselt number. Similarly, very low thermal conductivity also results in a low Nusselt number due to the fact that the heat distribution is converted to low ksf. Thus, we consider the largest ksf where we obtain the highest value of the Nusselt number by placing the graph between the two excess values. The effects of various geometry on the distribution of temperature and flexibility have also been analysed in this report. It therefore appears that conductivity is the main value as it affects the Nusselt number due to axial back conduction and the Nusselt number increases with re-charging.