This paper reports a novel approach using an inductive loading to reduce the resonant frequency of a mushroom-shaped high impedance surface. The current path is extended on the mushroom-shaped structure's vias and additional traces, which introduces a three-dimensional inductor to the unit cell and leads to an increase in total inductance. As a result, the resonant frequency of the high impedance structure decreases, and a smaller unit cell size can be achieved at the low gigahertz frequency range. Finite element electromagnetic simulation, equivalent circuits modeling, and experimental measurements suggest the feasibility of the proposed approach.

A high impedance surface has far-reaching potential in wireless applications, but realization of the surface operating at sub-GHz ranges is challenging due to its size limits in practical applications. Here, we present a novel inductive technique based on multi-turn square spiral loops. The introduction of the spiral loops to a mushroom-shaped high impedance surface provides additional current path, thereby results in a dramatic increase in its total inductance at given dimensions, and therefore leads to a significant reduction in a resonant frequency of a high impedance plane. Electromagnetic simulation results reveal that a resonant frequency shifts downward 1 GHz at a given dimension, and they are in good agreement with results from an analytical model for the proposed structure. Experimental measurements suggest the feasibility of the proposed approach.

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