This study was conducted to determine antioxidant activities in acetone, ethanol, methanol, and water extracts from the seeds of 4 persimmon cultivars. Antioxidant activities were evaluated on the basis of DPPH (1,1-diphenyl-2-picrylhydrazyl) radical-scavenging activity (RSA), ABTS (2,2-azino-bis [3-ethylbenzothiazoline-6-sulfonic acid]) RSA, and reducing power. Cheongdobansi seed extracts showed significantly higher antioxidant activities and phenolic contents than did Bongok, Fuyu, and Nishimurawase seed extracts. Ethanol was more effective for the extraction of antioxidant compounds from persimmons than other solvents. Palmitic acid, oleic acid, and linoleic acid were the main fatty acids found in persimmon seeds. Fuyu seeds contained the highest levels of fatty acids, and the unsaturated fatty acid contents of persimmon seeds range from 70.4% to 78.3%. All persimmon seed extracts, with the exception of the water extract of Nishimurawase seeds, inhibited DNA damage induced by H 2 O 2 .

No abstract

In order to develop processing methods with high physiological activity for Protaetia brevitarsis larvae (PBL), subcritical water (SCW) extraction was applied. The dried powder (1 g) of PBL was extracted with 10 mL distilled water at 100, 200, and 300 °C for 30 min. The SCW treatment significantly (p \ 0.05) increased some physiological activities of the PBL extracts. The SCW extract at 300 °C increased alcohol dehydrogenase, acetaldehyde dehydrogenase, and tyrosinase inhibitory activities from 192.3 ± 4.1% to 452.2 ± 0.5%, 125.4 ± 2.9% to 153.3 ± 0.4%, and -7.0 ± 0.7% to 26.1 ± 1.4%, respectively, compared to the extract at 100 °C. Contrarily, the inhibition activity of angiotensin converting enzyme was the highest at 200 °C. These results suggest that SCW is a suitable method to extract and maintain the physiological activity of PBL.

The flip-chip solder joint has become one of the most important technologies of high-density packaging in the microelectronics industry. But, electromigration has become a critical reliability issue in flip-chip technology. Because the dimensions of solder joints are expected to decrease and current density is expected to increase. This study is about electromigration of flip-chip solder joints, we evaluated many kinds of solder balls such as SnAgCu, SnCu and so on in flip chip package. The lifetime against electromigration was defined the fail from the value of resistance with electric current reaches 1.5 times of that of initial resistance with electric current for. In solder bumps with electric current, since the atoms composed of the solder bump and UBM move in the direction of electron flows, the IMC was accumulated on the anode side. Meanwhile, the IMC disappeared in the cathode side, and the voids were formed. In the solder bumps without electric current, the IMC gradually grew on both sides. SnAgCu had better lifetime than SnCu, and different time-to-failure caused by different crystallographic orientation of Sn. And various dopants in SnCu had a different EM lifetime each other.