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Three‐dimensional (3D) memories using through‐silicon vias (TSVs) as vertical buses across memory layers will likely be the first commercial application of 3D integrated circuit technology. The memory dies to stack together in a 3D memory are selected by a die‐selection method. The conventional die‐selection methods do not result in a high‐enough yields of 3D memories because 3D memories are typically composed of known‐good‐dies (KGDs), which are repaired using self‐contained redundancies. In 3D memory, redundancy sharing between neighboring vertical memory dies using TSVs is an effective strategy for yield enhancement. With the redundancy sharing strategy, a known‐bad‐die (KBD) possibly becomes a KGD after bonding. In this paper, we propose a novel die‐selection method using KBDs as well as KGDs for yield enhancement in 3D memory. The proposed die‐selection method uses three search‐space conditions, which can reduce the search space for selecting memory dies to manufacture 3D memories. Simulation results show that the proposed die‐selection method can significantly improve the yield of 3D memories in various fault distributions.

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