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Preferential nucleation of dynamic grains at triple junction (TJ) was investigated in copper tricrystal during high-temperature deformation. The nucleation of the dynamic grains at the TJ was observed at much lower strain than the peak strain where dynamic recrystallization (DRX) extensively took place. Further straining caused the incremental nucleation of dynamic grains on sliding grain boundaries accompanied by grain-boundary migration and serration. This occurred also at relatively lower strain than the peak strain. The DRX grains evolved to the most area of the tricrystal when deformed to about the peak strain. The observed preferential nucleation of DRX grains at the TJ was considered with relation of stress and deformation concentration there induced by folding and grain-boundary sliding.

Preferential occurrence of dynamic recrystallization (DRX) at triple junction (TJ) in pure copper tricrystals was investigated. DRX at TJ preferentially occurred at lower strain than the peak strain (about 2/3). All of the nucleated DRX grains at TJ were twins. Grain boundary sliding (GBS) was supposed to cause high stress concentration and deformation concentration near TJ because GBS was impeded at TJ. The twins were seemed to be nucleated behind the grain boundary migrating along the folding which was formed by impediment of GBS at TJ. These combined effects were supposed to cause the preferential DRX nucleation at TJ during high temperature deformation.

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