influenza virus infections, like respiratory syncytial virus infections, are a major cause of hospitalisation in children with respiratory illness during the winter season. Since it is impossible to make an aetiological diagnosis on clinical grounds, it is important to apply specific diagnostic tools in children hospitalised with respiratory illness in order to better characterise the relative burden of disease caused by the respective agents.

Silver electrodeposition onto Au(111) has been studied as a function of composition of deep eutectic solvent (DES) type III and IV. The electrochemical investigations were performed by using cyclic voltammetry and in‐situ electrochemical quartz crystal microbalance experiments. Scanning electron microscopy coupled with Auger spectroscopy and atomic force microscopy were used to characterize the deposited metal overlayers. Silver deposition from DES type III shows several analogies to the electrocrystallization from aqueous solutions, such as the presence of underpotential deposition. It is shown that the hydrogen‐bond donor exerts a strong influence on the silver growth mode and on the structure of the metal deposits. In addition, the hydrogen‐bond donor turns out to exert a rather strong influence on the plating process during silver deposition from DES type IV.

The electrodeposition of copper onto Au(111) from Deep Eutectic Solvents (DESs) type III has been studied by cyclic voltammetry. Investigations were carried out with mixtures of choline chloride (ChCl) and ethylene glycol (EG) or trifluoroacetamide (TFA). The eutectic compositions and temperatures were determined by differential scanning calorimetry (DSC). For the ChCl/EG DES, a eutectic ratio of 16 : 84 (ChCl:EG) was found instead of the previously reported ratio of 33 : 67. The electrodeposition of copper was studied for electrolytes with different ratios of ChCl to hydrogen bond donor (HBD) to resolve the influence of the composition on the deposition behavior. Both CuCl and CuCl 2 were used as Cu salts. Underpotential deposition (UPD) is followed by bulk deposition with the diffusion rate of Cu species being dependent on the ratio of ChCl to HBD. With CuCl 2 , both Cu + and Cu 2 + species are reduced and deposited, whereby the two-electron reduction is more dominant with higher chloride content and presence of EG. However, the properties of the Cu electrodeposition do not result from the freezing-point depression of the DESs, but from the high concentration of ions.