CoPt thin films with various Cu contents varying from 0 vol.% to 21.5 vol.% were deposited on glass substrates by magnetron sputtering. The effects of Cu additive on the structural and magnetic properties and the ordering temperature of CoPt films were investigated in detail. The results show that the Cu in CoPt films plays an important role in promoting the ordering parameter S and reducing the ordering temperature of CoPt films. A nearly perfect (001) texture was obtained in a CoPt film doped with 15.3 vol.% Cu. Besides, the preferred orientation of the CoPt film can be changed by annealing temperature. The perpendicular growth of the CoPt film is favored at a high annealing temperature.

Abstracr -We present the magnetoresistance andCu8,,Nil6Fe4 ( i n wt%) ribbons were prepared by conventional melt spinning and rapid solidification process in an argon atmosphere using a copper wheel rotating at a surface speed of -50 &sec. The ribbons were 2 mm wide, 20-30 , y m thick, and 10-15 cm long. The melt-spun ribbons magnetization behavior in melt-spun CuggNi16Peq ribbons.