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Over past few decades, the electronic boards density and performance are enhanced by entrenching the components in the interior surfaces of the printed circuit boards (PCBs).The worthiness of this novel innovation has to be probed to warranty the functioning of electronic boards acquiesced to callous environments. In this study, a novel advancement concentrating on the development of bio-based materials for the PCB applications has been documented. The biobased composite from rice husk-epoxy resin could impendingly substitute the conventional synthetic fiber reinforced epoxy composites in PCB applications. The essential properties of biocomposites were assessed such as tensile and bending properties, dielectric property, thermal properties, moisture absorption, microdrilling, biodegradability, and flammability. Results obtained found that, these biocomposites were promising for PCB application.

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The use of renewable resources to reduce environmental effects can provide a long-term platform. The natural fiber is an excellent renewable resource for developing lightweight composite materials. The present work is the development of hybrid areca/carbon/basalt reinforced epoxy/bio epoxy composites and the investigation of their mechanical, thermal, and water absorption behavior. Four layered areca-carbon, areca-basalt, and areca fiber reinforced epoxy/bio epoxy composites were fabricated with three different varying stacking sequences with epoxy and bio epoxy composites with a hand layup method. The Mechanical properties like tensile, flexural, and impact behavior were evaluated and compared between the synthetic and bio epoxy resin. Also, the thermal, water absorption, and morphological studies of all composites were studied, and results showed that out of all the composites the carbonareca fiber reinforced composites showed better mechanical properties and SEM analysis exemplified the better bonding between areca, carbon, and basalt fabrics. The prepared laminates can be used for developing some commercial medium-load structural applications.