Lead-free solders have become a main focus of the electronic industry in recent years, because of the high toxicity of lead. Alloys based on the Sn-Bi system figure as potential replacements for Sn-Pb alloys in soldering due to favorable properties and low cost. One of the main advantages of these alloys are low melting temperatures, while additional advantages include good compatibility with substrates, low process temperature, high reliability, and potential applications in conjunction with reduced graphene oxide nanosheets as thermal interface materials. In this paper, characterization of microstructural and thermal properties as well as hardness measurements of seven alloys of different Sn-Bi compositions are performed. Structural properties of the samples were analyzed using optical microscopy and scanning electron microscopy and energy dispersive X-ray spectroscopy (SEM-EDS). Thermal conductivity of the samples was investigated using the xenon-flash method, and phase transition temperatures were measured using the differential scanning calorimetry (DSC) analysis.

Physico-chemical processes that take place during the refining process in the extractive metallurgy of lead, are connected with ternary Pb−Zn−Ag system, which is necessary to study from the theoretical practical and aspects. Such investigation is important from production point of view, because of the phenomena that occur during desilvering of lead which is one of the important stages during lead refining process. Process of lead desilvering binds to ternary system Pb−Zn−Ag, which was the reason for numerous investigations, both from thermodynamic point of view and in terms of testing and determining the phase diagram, bearing in mind the theoretical, and practical importance of knowledge about the processes which are going in investigated system. The paper presents the results of thermodynamic analysis and investigation of phase equilibria of the Pb−Zn−Ag ternary system using the method of thermodynamic predictions and phase diagrams calculations, respectively, and the experimental results of metalography obtained by optical microscopy. Phase diagram of the vertical section Pb−Zn80Ag20 is presented, obtained by CALPHAD calculation methodology, and using PANDAT thermodynamic software, compared to experimental results obtained by DTA analysis. The results show a pronounced break in solubility, which is characteristic for the whole ternary Pb−Zn−Ag system. Also, it can be noticed that the thermodynamic properties follow the behavior of this system, which is expressed through positive deviation of Raoult’s law, pointing to the lack of lead affinity compared to the other two components in the system. The optical microscopy results of the investigated system show the following: - Sample L1 (weight% Pb = 98): the structure of the observed section shows double eutectic (Pbsol+Zn−Agsol) which lies in the base of the primary crystals of lead (Pbsol) - Samples L2−L5: the structure consists of a dual eutectic (Pbsol+Zn−Agsol) and primary crystals Zn−Agsol Also, it can be noticed certain structural inhomogenity, as a consequence of stratification that occurs in the ternary Pb−Zn−Ag system. However the metalography investigation results confirm the results obtained by defining the phase diagram and mutually agree relatively well in accordance with existing literature data

Life-cycle assessment (LCA) presents a relatively new approach, which allows comprehensive environmental consequences analysis of a product system over its entire life. This analysis is increasingly being used in the industry, as a tool for investigation of the influence of the product system on the environment, and serves as a protection and prevention tool in ecological management. This method is used to predict possible influences of a certain material to the environment through different development stages of the material. In LCA, the product systems are evaluated on a functionally equivalent basis, which, in this case, was 1000 cubic centimeters of an alloy. Two of the LCA phases, life-cycle inventory (LCA) and life-cycle impact assessment (LCIA), are needed to calculate the environmental impacts. Methodology of LCIA applied in this analysis aligns every input and output influence into 16 different categories, divided in two subcategories. The life-cycle assessment reaserch review of the leadfree solders Sn-Cu, SAC (Sn-Ag-Cu), BSA (Bi-Sb-Ag) and SABC (Sn-Ag-Bi-Cu) respectively, is given in this paper, from the environmental protection aspect starting from production, through application process and finally, reclamation at the end-of-life, i.e. recycling. There are several opportunities for reducing the overall environmental and human health impacts of solder used in electronics manufacturing based on the results of the LCA, such as: using secondary metals reclaimed through post-industrial recycling; power consumption reducing by replacing older, less efficient reflow assembly equipment, or by optimizing the current equipment to perform at the elevated temperatures required for lead-free soldering, etc. The LCA analysis was done comparatively in relation to widely used Sn-Pb solder material. Additionally, the impact factors of material consumption, energy use, water and air reserves, human health and ecotoxicity have been ALSO considered including the potentials for dissolution and recycling processes

The results of structural and mechanical characteristics of lead-free Cu-Sn based solder alloys, produced in Company "11. mart" AD Srebrenica (Republic of Srpska), are presented in this paper. The results of investigation of samples - alloys CuSnl4, CuSnlFelAlO.5, CuSnlOFelAllMnO.5 and CuA110Fe3Mn produced by different processing methods, include the data obtained by optical microscopy and measurements of hardness, micro hardness and electroconductivity, in order to characterize mentioned alloys and define the influence of processing method applied on their structural and mechanical properties. Microstructural experimental results of samples produced by casting in a metal mould with fast water cooling showed clearly sharp dendritic structure. Samples obtained by casting in a sand mould, displayed structure with big crystals, higher amount of segregation and inclusions on the grain boundaries, as a result of the slow cooling process. Hardness and microhardness tests showed increasing values as the amount of tin raised. Sample 3 showed the lowest value, as a result of the crystallization process and lackness of additional thermal treatment. Experimental results of the electroconductivity test showed that mentioned sample has got the highest value, which can be also explained by its production method. Results presented in this paper can contribute to investigations of copper-tin lead-free alloys, having in mind that various potential lead-free solders still haven't been completely investigated from the aspects of their structural, mechanical and electrical properties