The pair distribution function of nitrogen atoms in GaAs0.983N0.017 has been determined by scanning tunneling microscopy. Nitrogen atoms in the first and third planes relative to the cleaved (1 0) surface are imaged. A modest enhancement in the number of nearest-neighbor pairs particularly with [001] orientation is found, although at larger separations the distribution of N pair separations is found to be random.Considerable interest has developed in recent years concerning GaAsN and InGaAsN alloys with low N content, typically a few %. The large predicted band gap bowing in this system of highly mismatched anions leads to the possibility of considerable band gap reduction with modest N content [1,2]. Important applications include lasers with wavelength in the 1.3-1.55 µm range, as well as solar cells with band gap around 1.0 eV [3]. Generally speaking the GaAsN and InGaAsN alloys have displayed evidence of inhomogeneities, such as broad photoluminescence (PL) line widths, variable PL decay times, and short minority carrier diffusion lengths [4][5][6][7]. Such observations are often taken as an indicator of compositional fluctuations in the materials, although direct structural characterization of such fluctuations is lacking.In this work we use cross-sectional scanning tunneling microscopy (STM) to directly probe the arrangement of N atoms in GaAs 0.983 N 0.017 alloys. Nitrogen atoms of two distinct contrast levels are imaged, which we assign to occupation in the first and third surface planes relative to the (1 0) surface. From an accurate determination of the position of about 1000 N atoms in a continuous strip of alloy material, we compute the distribution function of pair separations. The arrangement of N atoms is found to be quite consistent with that expected from random occupation, with the exception that an enhanced occurrence of nearest-neighbor N pairs is found.The GaAsN alloys studied here were grown on GaAs(001) substrates by metal organic vapor phase epitaxy (MOVPE) at temperatures between 530 and 570 C using TMGa, TBAs or AsH3, and tertiarybutylhydrazine (TBHy) under hydrogen carrier gas. Additional details of the growth and characterization of the material can be found in Ref. [8]. The particular film studied here consists of a GaAs buffer layer followed by a GaAs 0.983 N 0.017 layer, a 52 nm thick GaAs spacer layer, a GaAs 0.972 N 0.028 layer, and a 370 nm thick GaAs cap layer. The thickness of the GaAsN layers was determined by high-resolution x-ray diffraction (HRXRD) to be about 18 nm; STM measurements of their thickness gave results of 14-19 nm depending on location in the wafer. The N contents quoted above were also determined by HRXRD; STM measurements for those quantities gave similar results. The GaAs substrate, buffer layer, and cap layer were doped with Si at a con-1 1°P ublished in Appl. Phys. Lett. 78, 82 (2001).
Epitaxy of high-quality GaN on sapphire requires a rather sophisticated substrate preparation prior to the GaN epilayer growth, namely nitridation of the substrate’s surface, growth of a GaN nucleation layer at a relative low temperature, and reduction of the defect density of this layer by a subsequent annealing step. For studying both, the detailed mechanisms of this complex procedure and its growth parameter dependencies, we attached an in situ spectroscopic ellipsometer to a nitride metal-organic vapor phase epitaxy reactor. First, the high-temperature dielectric function of GaN was measured using samples from different suppliers. Based on these data, the effect of growth parameter variations on the crystal quality of GaN epilayers could be monitored in situ. In particular, we determined the threshold temperature and the duration of the substrate nitridation under ammonia as well as the thermal threshold and duration of the nucleation layer transformation. Additionally, based on the in situ measurements a qualitative estimate for the crystalline quality of the nucleation layer and the epilayer is provided. Finally, the surface roughness of differently prepared GaN layers was evaluated by using the high-energy spectroscopic range of our vacuum-ultraviolet ellipsometer (3.5–9.0 eV).
Nitrogen atoms in the cleaved (1 0) surfaces of dilute GaAsN and InGaAsN alloys have been studied using cross-sectional scanning tunneling microscopy. The distribution of nitrogen atoms in GaAs0.983N0.017 and In0.04Ga0.96As0.99N0.01 alloys is found to be in agreement with random statistics, with the exception of a small enhancement in the number of [001]-oriented nearest neighbor pairs. The effects of annealing on In0.04Ga0.96 As0.99N0.01 alloys has been studied by scanning tunneling spectroscopy. Spectra display a reduced band gap compared to GaAs but little difference is seen between as-grown versus annealed InGaAsN samples. In addition, voltage dependent imaging has been used to investigate second-plane nitrogen atoms.
The morphology of InN layers grown directly on sapphire is strongly affected by the large lattice mismatch; epitaxial layers exceeding a thickness of 150 nm were found to partially bulge and peel off, regardless of different growth parameters. In-situ spectroscopic ellipsometry was crucial to identify the occurring process. Parasitic nucleation is another issue in InN MOVPE growth, but we showed that this can be controlled with slightly higher growth temperatures. The pseudodielectric function of InN was measured by means of SE in the range from 0.5 to 6.4 eV and the dielectric function of InN was calculated with an optical model in the bandgap region, determining a bandgap energy of 1.0 eV at room temperature for InN grown by MOVPE. In this work spectroscopic ellipsometry (SE) is applied to analyse the optical properties of InN from the near infrared to the UV range (0.5 to 6.4 eV). In-situ data are recorded at growth and room temperature in the reactor in order to optimise epitaxy and avoid oxide effects, and ex-situ data are measured over an extended range starting well below the bandgap energy.
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