Metallization of dielectrics a new physicochemical, mechanical and decorative properties is give to them 1-7. Depending on the type of dielectric material and on the aims to be coated, have been proposed various methods of metallization, among which was the largest use of chemical-electrolytic metallization 3,4. For create a conductive layer in this process the dielectric surface is activated by formation of a catalytic centers, which are then coated by chemical means. At that the active centers consisting of easily reduce metals atoms (copper, silver, palladium), through reduction of metal ions (adsorbed on the surface of dielectric material) by water-soluble or gaseous reducing agent are formed 1-7. As gaseous reducing agent most commonly used hydrogen, and the reduction reaction at high order of several hundred degrees temperature is carried out.
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