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We report great possibilities of ion implantation technology for applying to high-power GaN electron devices. We demonstrated high-performance normally-off self-aligned metal gate GaN MISFETs with Si ion implantation to reduce the contact resistances for ohmic contacts and N ion implantation for the device isolation. We formed p-type GaN in n-type GaN using Mg ion implantation and observed p-n junction diode behavior on forward I-V characteristics and EL measurements.

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This paper demonstrates that threshold voltages of GaN MISFET are controllable by varying the Mg ion doses for Mg ion implantation. Furthermore, it demonstrates for the first time that the short channel effect can be suppressed using a halo structure that has a p-layer in channel regions adjacent to source/ drain regions using tilt ion implantation. A device with a Mg dose of 8 × 10 13 /cm 2 achieved maximum drain current of 240 mA/mm and a transconductance of 40 mS/mm. These results indicate a definite potential for the use of our new process in GaN MISFETs for applications in power switching devices.