We present a molecular dynamics simulation study on the effects of crack formation on the mechanical properties of bilayer graphene. Bilayer graphene possesses unique electronic properties that can be modified by applying a voltage, making it an attractive material for various applications. We examined how the mechanical properties of bilayer graphene vary under various crack configurations and temperatures, measuring Young’s modulus, fracture toughness, fracture strain, and fracture stress. We compared the effect of crack presence on single and both layers and found the appearance of double peaks in the stress–strain curves in the case of a monolayer crack, indicating a subsequent fracture of the cracked layer and the uncracked layer. We also examined the effect of crack shape, size, and orientation on mechanical properties, including circular, hexagonal, and rectangular cracks along two axes. We found that both circular and hexagonal cracks had a smaller Young’s modulus and toughness than rectangular cracks, and the orientation of the crack had a significant impact on the mechanical properties, with a 2.5-times higher toughness for cracks with a length of 15Å. Additionally, we found that Young’s modulus decreases with increasing temperature in bilayer graphene with cracks on both layers. Our findings provide valuable insights into the potential applications of bilayer graphene in the design of advanced nanoscale electronic devices.

Recent advancements have led to the synthesis of novel monolayer 2D carbon structures, namely quasi-hexagonal-phase fullerene (qHPC60) and quasi-tetragonal-phase fullerene (qTPC60). Particularly, qHPC60 exhibits a promising medium band gap of approximately 1.6 eV, making it an attractive candidate for semiconductor devices. In this study, we conducted comprehensive molecular dynamics simulations to investigate the mechanical stability of 2D fullerene when placed on a graphene substrate and encapsulated within it. Graphene, renowned for its exceptional tensile strength, was chosen as the substrate and encapsulation material. We compared the mechanical behaviors of qHPC60 and qTPC60, examined the influence of cracks on their mechanical properties, and analyzed the internal stress experienced during and after fracture. Our findings reveal that the mechanical reliability of 2D fullerene can be significantly improved by encapsulating it with graphene, particularly strengthening the cracked regions. The estimated elastic modulus increased from 191.6 (qHPC60) and 134.7 GPa (qTPC60) to 531.4 and 504.1 GPa, respectively. Moreover, we observed that defects on the C60 layer had a negligible impact on the deterioration of the mechanical properties. This research provides valuable insights into enhancing the mechanical properties of 2D fullerene through graphene substrates or encapsulation, thereby holding promising implications for future applications.