Cu-Mo composites have been one of candidates for material of heat-sinks in electronic devices. We obtained Cu-Mo composites by electrodeposition using CuSO 4 and Na 2 MoO 4 with trisodium citrate as complexing agent. The presence of molybdenum in Cu-Mo was demonstrated by X-ray photoelectron spectroscopy and inductively coupled plasma atomic emission spectroscopy. The molybdenum content in Cu-Mo composites depended on the concentration ratio of Na 2 MoO 4 /(Na 2 MoO 4 + CuSO 4 ) in the electrolyte, kinds and concentration of complexing agents. The mol ratio of Na 2 MoO 4 /(Na 2 MoO 4 + CuSO 4 ), from 0.75 to 0.87 provided larger molybdenum content at 0.05 A/dm 2 of electrodeposition current. The molybdenum content increased with decreasing current density during electrodeposition in the range of 0.05-0.3 A/dm 2 . Trisodium citrate was the most effective complexing agent among trisodium citrate, glycolic acid, EDTA (4Na) and combinations of them for increasing molybdenum content. The molybdenum content reached up to 22.9 wt% at 0.396 mol/dm 3 of trisodium citrate concentration. X-ray diffraction shows that no peaks related to molybdenum was observed, moreover, the intensity and the width of Cu(111) peaks decreased and enlarged with increasing molybdenum content. These indicate that the structure of molybdenum in copper-molybdenum composites was amorphous, furthermore, higher molybdenum content made copper structure close to amorphous.

Nano-Imprint Lithography (NIL) is considered a promising alternative to optical lithography for technology nodes at 22nm hp and beyond. Compared to other advanced and complex lithography methods, NIL processing is simple and inexpensive making it a widely accepted technology for pattern media and a potential cost effective alternative for CMOS applications. During the NIL process, the template comes into direct contact with the resist on the substrate and consequently template cleanliness plays a decisive role in imprinted substrate quality. Furthermore, if the template has any form of a defect such as resist residue, stains, particles, surface scratches, chipping and bumping etc. it can lead to poor quality imprints, low yield and throughput decreases. The latest ITRS roadmap has stringent CD, CD uniformity, surface roughness and defect control requirements for NIL templates. Any template cleaning process that is adopted must be able to remove defects while maintaining the critical parameters outlined by the ITRS. Aggressive chemistries (such as NH 4 OH or SC1 (NH 4 OH+H 2 O 2 +DI) and strong physical force treatments (such as MegaSonic & Binary Sprays) may cause damage to the template if not optimized. This paper presents the cleaning chemical effects on template surface roughness and CD at varying concentrations. The effect of physical force cleaning on fragile and sensitive pattern features is also presented. Particle & imprint resist removal efficacy at different process conditions is compared.

It was noted recently ulal the ADM diffeomorphism constraint does not generate all observed symmetries for several Bianchi models. We will suggest not using the ADM constraint restricted to homogeneaus variables, but Some equivalent. which is derived from a restricted aclion principle. This will generate all homogeneity preserving diffeomorphisms. which will L x shown to be automorphism generaling vector fields, in class A and class B models. Following Dim's constraint formalism one will naturally be restricted to the unimodular pwl of the automorphism group.

Codeposition of copper and molybdenum was obtained by electroplating using CuSO 4 and Na 2 MoO 4 with trisodium citrate as complexing agent. The molybdenum content which was investigated by inductively coupled plasma atomic emission spectroscopy in electroplated Cu-Mo increased, from 0.5 to 7.1 wt%, with decreasing current density in the range from 0.1 to 1.2 A/dm 2 during electroplating. X-ray diffraction showed that the structure of molybdenum is amorphous, and higher molybdenum content gave smaller and wider Cu (111) peaks, furthermore, made the surface morphology smoother. These suggest that molybdenum atoms are introduced into copper crystal lattices, resulting in breaking copper crystal lattices.

No abstract