Abstract-Graphene and some graphene like two dimensional materials; hexagonal boron nitride (hBN) and silicene have unique mechanical properties which severely limit the suitability of conventional theories used for common brittle and ductile materials to predict the fracture response of these materials. This study revealed the fracture response of graphene, hBN and silicene nanosheets under different tiny crack lengths by molecular dynamics (MD) simulations using LAMMPS. The useful strength of these two dimensional materials are determined by their fracture toughness. Our study shows a comparative analysis of mechanical properties among the elemental analogues of graphene and suggested that hBN can be a good substitute for graphene in terms of mechanical properties. We have also found that the pre-cracked sheets fail in brittle manner and their failure is governed by the strength of the atomic bonds at the crack tip. The MD prediction of fracture toughness shows significant difference with the fracture toughness determined by Griffth's theory of brittle failure which restricts the applicability of Griffith's criterion for these materials in case of nano-cracks. Moreover, the strengths measured in armchair and zigzag directions of nanosheets of these materials implied that the bonds in armchair direction have the stronger capability to resist crack propagation compared to zigzag direction.

The mechanical properties of indium phosphide (InP) nanowires are an emerging issue due to the promising applications of these nanowires in nanoelectromechanical and microelectromechanical devices. In this study, molecular dynamics simulations of zincblende (ZB) and wurtzite (WZ) crystal structured InP nanowires (NWs) are presented under uniaxial tension at varying sizes and temperatures. It is observed that the tensile strengths of both types of NWs show inverse relationships with temperature, but are independent of the size of the nanowires. Moreover, applied load causes brittle fracture by nucleating cleavage on ZB and WZ NWs. When the tensile load is applied along the [001] direction, the direction of the cleavage planes of ZB NWs changes with temperature. It is found that the {111} planes are the cleavage planes at lower temperatures; on the other hand, the {110} cleavage planes are activated at elevated temperatures. In the case of WZ NWs, fracture of the material is observed to occur by cleaving along the (0001) plane irrespective of temperature when the tensile load is applied along the [0001] direction. Furthermore, the WZ NWs of InP show considerably higher strength than their ZB counterparts. Finally, the impact of strain rate on the failure behavior of InP NWs is also studied, and higher fracture strengths and strains at higher strain rates are found. With increasing strain rate, the number of cleavages also increases in the NWs. This paper also provides in-depth understanding of the failure behavior of InP NWs, which will aid the design of efficient InP NWs-based devices.

Nanostructures have the immense potential to supplant the traditional metallic structure as they show enhanced mechanical properties through strain hardening. In this paper, the effect of grain size on the hardening mechanism of Al-Cu nanostructure is elucidated by molecular dynamics simulation. Al-Cu (50-54% Cu by weight) nanostructure having an average grain size of 4.57 to 7.26 nm are investigated for tensile simulation at different strain rate using embedded atom method (EAM) potential at a temperature of 50~500K. It is found that the failure mechanism of the nanostructure is governed by the temperature, grain size as well as strain rate effect. At the high temperature of 300-500K, the failure strength of Al-Cu nanostructure increases with the decrease of average grain size following Hall-Petch relation. Dislocation motions are hindered significantly when the grain size is decreased which play a vital role on the hardening of the nanostructure. The failure is always found to initiate at a particular Al grain due to its weak link and propagates through grain boundary (GB) sliding, diffusion, dislocation nucleation and propagation. We also visualize the dislocation density at different grain size to show how the dislocation affects the material properties at the nanoscale. These results will further aid investigation on the deformation mechanism of nanostructure.

Silicene, a 2D analogue of graphene, has spurred a tremendous research interest in the scientific community for its unique properties essential for next-generation electronic devices. In this work, for the first time, we present a molecular dynamics (MD) investigation to determine the fracture strength and toughness of nanocrystalline silicene (nc-silicene) sheet of varying grain sizes and pre-existing cracks at room temperature. Our results suggest a transition from an inverse pseudo Hall-Petch to a pseudo Hall-Petch behaviour in nc-silicene at a critical grain size of 17.32 nm. This phenomenon is also prevalent in nanocrystalline graphene. However, nc-silicene with pre-existing cracks exhibits anomalous crack propagation and fracture toughness behaviour. We observed two distinct types of failure mechanisms (crack sensitive and insensitive failure) and devised mechano-physical conditions under which they occur. The most striking outcome is: despite the presence of a pre-existing crack, the crack sensitivity of nc-silicene is found to be dependent on the grain size and their orientations. The calculated Fracture toughness from both Griffith’s theory and MD simulations indicate that the former over-predicts the fracture toughness of nc-silicene. Finally, this study is the first direct comparison of atomistic simulations to the continuum theories to predict the anomalous behaviour in deformation and failure mechanisms of nc-silicene.

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