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For the series production of adaptive fibre-reinforced thermoplastic structures, the development of process-adapted piezoceramic modules is gaining central importance. Therefore, thermoplastic-compatible piezoceramic modules (TPMs) are being developed which are suitable for a matrix-homogeneous adhesive-free integration of the modules in fibre-reinforced thermoplastic structures during a sequential hot-pressing process.Extensive numerical and experimental studies are available on the systematic development of the TPMs, whose thermoplastic carrier film, made, respectively, of polyetheretherketone (PEEK) or polyamide (PA), is already adapted to the matrix material of a thermoplastic composite structure and thus can be joined in a welding process without additional adhesives. The studies carried out indicate the influence of geometrical and technological parameters on the efficiency of consolidated and polarized TPMs and can thus be used to adapt the design specifications and process parameters of the TPMs. Besides these studies, a numerically based residual stress analysis shows the potential for a defined inducing of residual stresses in the TPM components.

The use of active composite structures in high-volume applications requires novel robust manufacturing processes as well as specially adapted functional modules. The paper presents actual research results with regard to the process-immanent polarization of novel thermoplastic-compatible piezoceramic modules (TPM) during the consolidation process of active fibre-reinforced thermoplastic composite structures. In particular the influence of varying manufacture process parameters of a hot-press process on the polarization behaviour is investigated. The main principal objective is the purposeful utilization of process parameters for polarization support.

Against the background of an integration of piezoceramic modules into thermoplastic composite structures the development of thermoplastic-compatible piezoceramic modules (TPM) requires the consideration of the type of module-structure-connection and module position for an optimal strain transmission. While commercially available low profile transducers are applied predominantly by adhesive bonding, TPM with thermoplastic carrier films identical to the thermoplastic matrix of the composite structure offer the possibility for a material-homogeneous integration by a hot-pressing process. The aim of the presented work is to examine the influence of an adhesive layer as well as the comparison of adhesive bonding and module integration by a hot-pressing process. Therefore a common analytic model and the Finite Element Method (FEM) is used. Particular regard is given to a maximum strain transmission between the functional module and the composite structure. For pure bending as well as for pure linear expansion the studies show the advantages of a material-homogeneous integration of function modules.

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