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The study aims to enhance the thermal and mechanical properties of epoxy composite materials. This is done based on combination of micron sized aluminium nitride (AlN) and hexagonal boron nitride (hBN) particles. A set of AlN/BN hybrid epoxy composites with filler content ranging from 35, 40, and 42 wt% was prepared by conventional casting method. The use of these hybrid fillers was found to be very effective in increasing the composite thermal conductivity due to synergetic connectivity offered by the fillers with different geometries; polyhedral AlN and hBN platelets. Maximum thermal conductivity of 0.57 W mK−1 was achieved for the formulation of AlN:BN = 2:1 at 42 wt% filler loading. Glass transition (Tg), coefficient of thermal expansion (CTE), and modulus of the composites were measured experimentally. The integrated properties of AlN/BN epoxy composites are expected to enhance the heat dissipating capabilities in microelectronic industry. POLYM. COMPOS., 39:E1372–E1380, 2018. © 2016 Society of Plastics Engineers

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The improvement of heat conduction in any electronic devices has become a predominant issue in which effective heat dissipation is crucial to enhance the performance of packaged devices. This paper elucidates the application of thermally conductive particles filled composites as thermal interface material for LEDs. Present work aims on reducing the junction temperature and thermal resistance of the device under test with heavily filled ceramic-epoxy composite as the interface material between the device and metal substrate. Silane treated aluminium nitride (AlN) powder was studied for its feasibility as the filler material. The thermal conductivity values obtained by hot disc method (ISO/DIS 22007-2.2) were 0.66, 0.54 and 0.44 W/mK for 60, 50 and 40 wt% AlN filled epoxy composites respectively which were described well by thermal transient measurement of LEDs. The junction temperature and total thermal resistance of the thermal set up was reduced significantly with increased filler loading. The least junction to ambient thermal resistance (R thJ-A ) was achieved for 60 wt% followed by 50 and 40 wt% AlN filled TIM with the values of 24.8, 31.98 and 34.64 K/W respectively. Characteristics of the AlN filled composites for LED applications are discussed extensively in terms of thermogravimetric and thermo-mechanical analysis.