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Devices capable of actively controlling heat flow have been desired by the thermal management community for decades. The need for thermal control has become particularly urgent with power densification resulting in devices with localized heat fluxes as high as 1 kW/cm2. Thermal switches, capable of modulating between high and low thermal conductances, enable the partitioning and active control of heat flow pathways. This paper reports a millimeter-scale thermal switch with a switching ratio >70, at heat fluxes near 10 W/cm2. The device consists of a silicone channel filled with a reducing liquid or vapor and an immersed liquid metal Galinstan slug. Galinstan has a relatively high thermal conductivity (≈16.5 W/mK at room temperature), and its position can be manipulated within the fluid channel, using either hydrostatic pressure or electric fields. When Galinstan bridges the hot and cold reservoirs (the “ON” state), heat flows across the channel. When the hot and cold reservoirs are instead filled with the encapsulating liquid or vapor (the “OFF” state), the cross-channel heat flow significantly reduces due to the lower thermal conductivity of the solution (≈0.03–0.6 W/mK). We demonstrate switching ratios as high as 15.6 for liquid filled channels and 71.3 for vapor filled channels. This work provides a framework for the development of millimeter-scale thermal switches and diodes capable of spatial and temporal control of heat flows.

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Soft, wireless physiological sensors that gently adhere to the skin are capable of continuous clinical-grade health monitoring in hospital and/or home settings, of particular value to critically ill infants and other vulnerable patients, but they present risks for injury upon thermal failure. This paper introduces an active materials approach that automatically minimizes such risks, to complement traditional schemes that rely on integrated sensors and electronic control circuits. The strategy exploits thin, flexible bladders that contain small volumes of liquid with boiling points a few degrees above body temperature. When the heat exceeds the safe range, vaporization rapidly forms highly effective, thermally insulating structures and delaminates the device from the skin, thereby eliminating any danger to the skin. Experimental and computational thermomechanical studies and demonstrations in a skin-interfaced mechano-acoustic sensor illustrate the effectiveness of this simple thermal safety system and suggest its applicability to nearly any class of skin-integrated device technology.