The demonstration of vertical GaN wrap-around gated field-effect transistors using GaN nanowires is reported. The nanowires with smooth a-plane sidewalls have hexagonal geometry made by top-down etching. A 7-nanowire transistor exhibits enhancement mode operation with threshold voltage of 1.2 V, on/off current ratio as high as 108, and subthreshold slope as small as 68 mV/dec. Although there is space charge limited current behavior at small source-drain voltages (Vds), the drain current (Id) and transconductance (gm) reach up to 314 mA/mm and 125 mS/mm, respectively, when normalized with hexagonal nanowire circumference. The measured breakdown voltage is around 140 V. This vertical approach provides a way to next-generation GaN-based power devices.

In the past few years, tremendous progress has been demonstrated on epitaxial growth and processing of group III nitride nano‐ and microrods (NAMs). This has also enabled the fabrication of optoelectronic devices based on NAMs as active elements. However, their efficiency is still far behind the performance of conventional GaN‐based light emitting diodes (LEDs). This Review presents the most recent activities on the growth and processing of NAMs exhibiting a core–shell geometry, i.e. structures which consist of an active region shell layer wrapped around a three‐dimensional (3D) core, which allow for an enormous increase in active area compared to planar technology. The most common growth approaches using metalorganic vapour phase epitaxy are described and evaluated with particular regard to their potential for solid state lighting applications. Examples for the unique properties of 3D NAMs are presented including their excellent crystalline quality. Furthermore, factors limiting the overall performance of 3D core–shell LEDs are revealed and the potential of overcoming these limitations are discussed. (© 2013 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

Vertically aligned gallium nitride (GaN) nanowire (NW) arrays have attracted a lot of attention because of their potential for novel devices in the fields of optoelectronics and nanoelectronics. In this work, GaN NW arrays have been designed and fabricated by combining suitable nanomachining processes including dry and wet etching. After inductively coupled plasma dry reactive ion etching, the GaN NWs are subsequently treated in wet chemical etching using AZ400K developer (i.e., with an activation energy of 0.69 ± 0.02 eV and a Cr mask) to form hexagonal and smooth a-plane sidewalls. Etching experiments using potassium hydroxide (KOH) water solution reveal that the sidewall orientation preference depends on etchant concentration. A model concerning surface bonding configuration on crystallography facets has been proposed to understand the anisotropic wet etching mechanism. Finally, NW array-based vertical field-effect transistors with wrap-gated structure have been fabricated. A device composed of 99 NWs exhibits enhancement mode operation with a threshold voltage of 1.5 V, a superior electrostatic control, and a high current output of >10 mA, which prevail potential applications in next-generation power switches and high-temperature digital circuits.

850 1090A uniform array of gallium nitride core-shell microrod (MR) lightemitting diode (LED) structures was grown by metalorganic vapor phase epitaxy. Defects and the quantum well (QW) luminescence in an individual rod were investigated by scanning tunneling electron microscopy (STEM) and STEM cathodoluminescence. Luminescence with different wavelength was detected from the quantum wells on the semipolar tip facets and the nonpolar sidewalls of the MRs. Furthermore, the MR array is processed into LED chips. The electro-optical characteristics of the devices are analyzed. Two separate emission bands are distinguished, which are attributed to the QWs on the semipolar tip facets and the nonpolar sidewalls, respectively. To obtain white LEDs, micrograin phosphors were developed which fit in between individual MRs. By using electrophoretic particle deposition, these phosphors are deposited onto the MR LED chips. Color coordinates, color temperature, and device efficiency are evaluated.Blue (top) and phosphor-converted white (bottom) microrod LEDs on 4 00 wafer.

Nitride-based three-dimensional core-shell nanorods (NRs) are promising candidates for the achievement of highly efficient optoelectronic devices. For a detailed understanding of the complex core-shell layer structure of InGaN/GaN NRs, a systematic determination and correlation of the structural, compositional, and optical properties on a nanometer-scale is essential. In particular, the combination of low-temperature cathodoluminescence (CL) spectroscopy directly performed in a scanning transmission electron microscope (STEM), and quantitative high-angle annular dark field imaging enables a comprehensive study of the nanoscopic attributes of the individual shell layers. The investigated InGaN/GaN core-shell NRs, which were grown by metal-organic vapor-phase epitaxy using selective-area growth exhibit an exceptionally low density of extended defects. Using highly spatially resolved CL mapping of single NRs performed in cross-section, we give a direct insight into the optical properties of the individual core-shell layers. Most interesting, we observe a red shift of the InGaN single quantum well from 410 to 471 nm along the nonpolar side wall. Quantitative STEM analysis of the active region reveals an increasing thickness of the single quantum well (SQW) from 6 to 13 nm, accompanied by a slight increase of the indium concentration along the nonpolar side wall from 11% to 13%. Both effects, the increased quantum-well thickness and the higher indium incorporation, are responsible for the observed energetic shift of the InGaN SQW luminescence. Furthermore, compositional mappings of the InGaN quantum well reveal the formation of locally indium rich regions with several nanometers in size, leading to potential fluctuations in the InGaN SQW energy landscape. This is directly evidenced by nanometer-scale resolved CL mappings that show strong localization effects of the excitonic SQW emission.