A procedure and optical concept is introduced for ultrashort pulsed laser cleaving of transparent materials with tailored edges in a single pass. The procedure is based on holographically splitting a number of foci along the desired edge geometry including C-shaped edges with local 45° tangential angles to the surface. Single-pass, full-thickness laser modifications are achieved requiring single-side access to the workpiece only without inclining the optical head. After having induced laser modifications with feed rates of ∼1m/s, actual separation is performed using a selective etching strategy.

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