Advancements in space and ground-based astronomy focal plane array (FPA) technology at Rockwell Scientific Company (RSC) are presented. The review covers the broad base of astronomy work at RSC for both present and next generation FPAs, and details recent achievements in detector, readout, and packaging technologies. RSC astronomy FPA progress includes: RSC FPA delivery for NASA's successful Deep Impact mission, progress on RSC's programs supplying H-2RG FPAs for James Webb Space Telescope (JWST) instruments JWST NIRCam, NIRSpec and FGS; selection of RSC's SIDECAR Application Specific Integrated Circuit (ASIC) for use on JWST instruments NIRCam, NIRSpec and FGS and the development of the JWST SIDECAR space flight package; first silicon on the 16 million pixel HAWAII-4RG (4Kx4K); optimization of NIR FPAs for space telescope missions; construction of multiple 16 million pixel 2x2 mosaic FPAs using the HAWAII-2RG readouts, and the development of the Microlensing Planet Finder (MPF) very large, 150 million pixel FPA.

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