This paper studies the effects of heating rate 4 × 10[Formula: see text] K/s, 4 × 10[Formula: see text] K/s, 4 × 10[Formula: see text] K/s; impurity concentration of Cu on Ni[Formula: see text]Cu[Formula: see text] bulk with x = 0.1, x = 0.3, x = 0.5, x = 0.7; atom number (N), N = 4000 atoms, 5324 atoms, 6912 atoms, 8788 atoms at temperatures (T), T = 300 K; N = 6912 atoms at T = 300 K, 400 K, 500 K, 600 K, 700 K, 800 K; N = 6912 atoms at T = 600 K after time annealing temperature (t), t = 500 ps on the structure, crystallization temperature and crystallization process of Ni[Formula: see text]Cu[Formula: see text] bulk by molecular dynamics (MD) method with interactive embedding Sutton–Chen (ST) and periodic boundary conditions. The structural characteristics were analyzed through radial distribution function (RDF), energy total (E[Formula: see text]), size (l) and common neighborhood analysis (CNA) method; temperature (T), crystallization temperature (T[Formula: see text]), crystallization process through relationship between E[Formula: see text], T. The results showed Ni[Formula: see text]Cu[Formula: see text] bulk and links Ni–Ni, Ni–Cu, Cu–Cu always exist in 03 types structures: FCC, HCP, Amor. When time annealing temperature increases then Ni[Formula: see text]Cu[Formula: see text] bulk moves from a crystalline state to an amorphous state. When increases impurity concentration of Cu in Ni[Formula: see text]Cu[Formula: see text] bulk, then the structure unit number FCC, HCP decreases and then increases, structure unit number Amor increases and then decreases. When atom number (N) increases, decreasing T and increasing time annealing temperature lead to structure unit number FCC, HCP increases, Amor decreases and structural, crystallization temperature, crystallization process of Ni[Formula: see text]Cu[Formula: see text] bulk change.