This study used Six Sigma DMAIC five-phase improvement procedures for an empirical research on a multinational optical interconnect manufacturer. The Taguchi method was used for the design of experiment, and the data obtained from the orthogonal table were used to determine the key factors and levels, in order to propose the optimal combination of processing parameters and levels for fiber patch cord 3D polishing. The combination of rough polishing time of 30s, polishing pressure of 0.02pa, polishing pad hardness of 65 degrees, and the fine polishing time of 80s could produce the fittest parameters for a satisfactory level, reduce the defect rate and waste of production cost, and reach the Six Sigma standard. The results proved that the improved process capability model, as constructed by this study, can effectively improve the apex offset quality of fiber patch cords. The findings can serve as references for engineers to improve the quality and production process capability.

This study applied the thermoelectric chip design and the establishment of the personalized air-conditioning system in the design of the single duct and double duct structures. According to the actual measurement results when the ambient temperature was 29°C, the air outlet temperature of the two structures was 22°C, 24°C respectively; the power consumption was 133W, 134W respectively. FLUENT was used to simulate the spatial flow field and temperature field for comparison to learn about the spatial temperature distribution status of the air-conditioning system.

In response to the trend of miniaturization of electronic components, SMT (Surface Mount Technology) technology is become increasingly important. According to statistics, more than 70% of SMT defects occur in the solder paste printing process; hence, provided the solder paste printing process is completed correctly, the SMT yield can be maintained at a certain level. The solder paste printing process is the core of SMT technology; inability to control the process parameters may easily lead to poor solder results, which reduce product quality and increases production costs. By integrating the Taguchi and FAHP (Fuzzy Analytic Hierarchy Process) methods, this study attempted to obtain the solder thickness Cpk optimal parameters and apply DOE (Design of Experiments) in experimentation to determine the optimum SMT solder thickness parameter combination for process engineers to rapidly implement and control the SMT solder thickness process according to the optimal SMT process parameters. The empirical results suggested that, the SMT solder printing thickness processing capability Cpk value has been improved from 0.58 to 1.47, which could improve the quality of relevant electronic products.