Articles you may be interested inModular cryogenic interconnects for multi-qubit devices Rev. Sci. Instrum. 85, 114706 (2014); 10.1063/1.4900948 Hybrid stretchable circuits on silicone substrate

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We discuss the self-repair of open faults in circuits using electrically conductive particles dispersed in an insulating fluid. The repair is triggered by the electric field developed across the open circuit in a current carrying interconnect and results in the formation of a bridge of particles across the gap. We illustrate and model the dynamics of the resistance of the self-healed route, Rb, in low field conditions. Furthermore, active control of Rb and active re-wiring are also demonstrated. Considering Rb to be akin to weights between nodes, the formation and re-wiring of routes and the control of Rb mimic synaptic plasticity in biological systems and open interesting possibilities for computing.

In order to build flexible electronic systems that can bend in two directions simultaneously, it is required that the substrate be able to stretch easily. This is achieved by the use of elastomeric substrates. Stretchable and bendable electronics reduces the reliability of the interconnect. Factors such as stretching, electrostatic discharge, interaction with the environment etc. increases the chance of interconnect failure due to open circuit faults. This paper describes a mechanism of self-healing open circuit faults by the use of a dispersion of conductive particles in an insulating fluid. Faults are typically repaired in 10s with the heal having a resistance of 10 Ohm-1000 Ohm. The paper provides an overview and the operational limits that determine the feasibility of using the technique to improve interconnect reliability in flexible electronics.