Semiconductor diodes are basic building blocks of modern computation, communications and sensing. As such, incorporating them into textile-grade fibres can increase fabric capabilities and functions,  to encompass, for example,  fabric-based communications or physiological monitoring. However, processing challenges have so far precluded the realization of semiconducting diodes of high quality in thermally drawn fibres. Here we demonstrate a scalable thermal drawing process of electrically connected diode fibres. We begin by constructing a macroscopic preform that hosts discrete diodes internal to the structure alongside hollow channels through which conducting copper or tungsten wires are fed. As the preform is heated and drawn into a fibre, the conducting wires approach the diodes until they make electrical contact, resulting in hundreds of diodes connected in parallel inside a single fibre. Two types of in-fibre device are realized: light-emitting and photodetecting p-i-n diodes. An inter-device spacing smaller than 20 centimetres is achieved, as well as light collimation and focusing by a lens designed in the fibre cladding. Diode fibres maintain performance throughout ten machine-wash cycles, indicating the relevance of this approach to apparel applications. To demonstrate the utility of this approach, a three-megahertz bi-directional optical communication link is established between two fabrics containing receiver-emitter fibres. Finally, heart-rate measurements with the diodes indicate their potential for implementation in all-fabric physiological-status monitoring systems. Our approach provides a path to realizing ever more sophisticated functions in fibres, presenting  the prospect of a fibre 'Moore's law' analogue  through the increase of device density and function in thermally drawn textile-ready fibres.

Electronic and photonic fiber devices that can sustain large elastic deformation are becoming key components in a variety of fields ranging from healthcare to robotics and wearable devices. The fabrication of highly elastic and functional fibers remains however challenging, which is limiting their technological developments. Simple and scalable fiber-processing techniques to continuously codraw different materials within a polymeric structure constitute an ideal platform to realize functional fibers and devices. Despite decades of research however, elastomeric materials with the proper rheological attributes for multimaterial fiber processing cannot be identified. Here, the thermal drawing of hundreds-of-meters long multimaterial optical and electronic fibers and devices that can sustain up to 500% elastic deformation is demonstrated. From a rheological and microstructure analysis, thermoplastic elastomers that can be thermally drawn at high viscosities (above 10 Pa s), allowing the encapsulation of a variety of microstructured, soft, and rigid materials are identified. Using this scalable approach, fiber devices combining high performance, extreme elasticity, and unprecedented functionalities, allowing novel applications in smart textiles, robotics, or medical implants, are demonstrated.

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