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We have fabricated and studied a ballistic one-dimensional p-type quantum wire using an undoped AlGaAs/GaAs heterostructure. The absence of modulation doping eliminates remote ionized impurity scattering and allows high mobilities to be achieved over a wide range of hole densities, and in particular, at very low densities where carrier-carrier interactions are strongest. The device exhibits clear quantized conductance plateaus with highly stable gate characteristics. These devices provide opportunities for studying spin-orbit coupling and interaction effects in mesoscopic hole systems in the strong interaction regime where r s > 10.

We investigate the surface quality of encapsulated Si:P δ-layers for the fabrication of multilayer devices with the potential to create architectures with sub 20 nm resolution in all three spatial dimensions. We use scanning tunneling microscopy to investigate how the dopant incorporation chemistry of the first active layer strongly affects the quality of the Si encapsulation which serves as the regrowth interface for the second active layer. Low temperature Hall measurements of the encapsulated layers indicate full dopant activation for incorporation temperatures between 250–750 °C with 20% higher carrier densities than previously observed.

Low resistivity, near-surface doping in silicon represents a formidable challenge for both the microelectronics industry and future quantum electronic devices. Here we employ an ultra-high vacuum strategy to create highly abrupt doping profiles in silicon, which we characterize in situ using a four point probe scanning tunnelling microscope. Using a small molecule gaseous dopant source (PH3) which densely packs on a reconstructed silicon surface, followed by encapsulation in epitaxial silicon, we form highly conductive dopant sheets with subnanometer control of the depth profiles. This approach allows us to test the limits of ultra-shallow junction formation, with room temperature resistivities of 780 Ω/□ at an encapsulation depth of 4.3 nm, increasing to 23 kΩ/□ at an encapsulation depth of only 0.5 nm. We show that this depth-dependent resistivity can be accounted for by a combination of dopant segregation and surface scattering.

We have studied ballistic transport in a 1D channel formed using surface gate techniques on a back-gated, high-mobility, bilayer 2D hole system. At millikelvin temperatures, robust conductance quantization is observed in the quantum wire formed in the top layer of the bilayer system, without the gate instabilities that have hampered previous studies of 1D hole systems.Using source drain bias spectroscopy, we have measured the 1D subband spacings, which are 5-10 times smaller than in comparable GaAs electron systems, but 2-3 times larger than in previous studies of 1D holes. We also report the first observation of the anomalous conductance plateau at G = 0.7 × 2e 2 /h in a 1D hole system.