A new microelectronics packaging technique, called Solid logic Technology (SLT), utilizes silicon planar glass-encapsulated transistors and diodes, and graphic arts techniques for producing high-quality, passive components having tight tolerances. The result is a process permitting the low-cost realization of a variety of versatile, high-performance circuit modules. The salient features of SLT are described: the unique form of the semiconductor devices, the module fabriaation process, and some performance results. In addition, insight is provided to the range of components that may be fabricated with this technology, i.e., inductors, capacitors and high-power transistors. Examples are shown of specific high-speed, high-density and complex circuit packages.

Semiconductor Manufacturing in \BW\, 1957 to the Present: A PerspectiveOver the past twenty-five years we have witnessed the transition from germanium-based, individual transistors in their hermetically sealed enclosures to VLSI silicon devices interconnected in modular packages containing more than 50 000 logic circuits or as many as 500 000 bits of random-access memory. During this progression, manufacturing facilities producing these modern products have become more complex and technologically more sophisticated than those of any other industry. This review traces these fast-moving changes as they have occurred in IBM, emphasizing the continuous expansion of manufacturing skills and disciplines and how these, in turn, have contributed to the development of today's products and their respective manufacturing systems. 43

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