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Characteristics of hole formation in laser welding technique for optoelectronic packaging have been investigated by metallographic microscopes. The results show that the dimension of hole depends on the power density of laser beam and the hole disappears as the power density below 3 x 1 O5 W/cm2. The hole generation between welded sections can cause spatial nonuniformity of solidificationshrinkage during laser welding process, resulting in generating micromovement. Micromovement due to failure mechanism of the hole formation during laser welding process may affect the alignment for optoelectronic packages, particularly for single-mode fiber applications. Based on our understanding of laser welding process characteristics, a reliability study of receptacle laser packages is currently under investigation.

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