In this study, anodically-bondable LTCC (low temperature cofired ceramic) substrates are proposed to provide electrical connective packaging by using novel nano-structured gold. On-chip MEMS compatible fabrication of nanoporous gold (NPG) was developed and its porous structure offers sponge-like functions which forms electrical contacts as well during anodic bonding. A MEMS integrated Si substrate is mechanically sealed to a metal feedthrough LTCC substrate by anodic bonding and its electrical connection is formed by the nanoporous structured pads simultaneously

OCT instruments permit fast and non-invasive 3D optical biopsies of biological tissues. However, they are bulky and expensive, making them only affordable at the hospital and thus, not sufficiently used as an early diagnostic tool. Significant reduction of system cost and size is achieved by implementation of MOEMS technologies. We propose an active array of 4x4 Mirau microinterferometers where the reference micro-mirrors are carried by a vertical comb-drive microactuator, enabling the implementation of the phase-shifting technique that improves the sensitivity and eliminates unwanted interferometric terms. We focus on the design of the imaging system, the microfabrication and the assembly of the Mirau microinterferometer, and the swept-source OCT imaging.