This paper considers the stress distributions in bonded materials induced by differential expansion or contraction of these materials. The analytical approach is similar to the lap joint theories attributed to Volkersen and expanded by Goland and Reissner. Several simple and typical analytical models are presented to bring out the relative importance of dlrerent geometrical and material parameters and to give some insight into different modes in which the bonds might fail.

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When a uniform heat flow in an infinite orthotropic solid is disturbed by the presence of a long circular insulated cavity, local intensification of the temperature gradient occurs in the neighborhood of the cavity. This report describes a study of the stress field induced by the temperature distribution. The linear plane (plane stress or plane strain) thermoelastic problem is solved by using the complex variable technique. The analysis may also be used for other steady-state thermal stress problems in an orthotropic medium.

A peel test is a useful method for comparing the behavior of various adherends and adhesives. An exact analysis of the mechanics of the peel test would be of great help in the interpretation of test results in terms of the bulk properties of the materials, and of the failure mechanism of the bond. The existing theories of peeling apply to elastic peel films, very thin elastic or viscoelastic adhesive, and a rigid substrate. In many applications the film is metallic, stressed beyond its elastic range; the elasticity of the substrate is often similar to that of the adhesive; and the adhesive may be quite thick compared to the film, or may be wholly absent as in electroplated components. In this paper, the effects of non-elastic behavior of the film are analyzed. Results from the use of computer programs that incorporate an analytical model of steady state peeling are presented and compared with experimental data.